Qisheng Precision
QSD1030 10-Inch Precision Dicing Saw — Large Format
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QSD Series · Precision Dicing Saw

QSD1030
10-Inch Precision Dicing Saw — Large Format

Largest QSD platform for large-format IC packaging and QFN/DFN strips

Wafer Size
10" (250 mm)
Spindle
High-power DC, max torque
Accuracy
±3 μm typical
Pattern Recognition
Auto optical alignment

The QSD1030 is the largest precision dicing saw in the QSD series — engineered for large-format IC packaging strips and high-volume QFN/DFN singulation. With maximum-travel XY stage and the most powerful DC spindle in the line-up, it processes the largest leadframe and PCB strip formats in production today.

Key Features

01

High-power DC spindle

High-torque drive for cutting tough composite materials — copper-rich leadframes, multilayer PCBs, BGA substrates.

02

Precision XY stage

High-accuracy linear positioning with closed-loop encoder feedback for repeatable results.

03

Auto pattern recognition

Optical alignment system for automated street recognition and offset compensation.

04

Multi-material capability

Configurable for silicon, GaAs, sapphire, ceramics, glass, LiNbO₃ and more.

05

Compatible consumables

Accepts Qisheng full blade range plus industry-standard hub blade specifications.

06

Lifetime software updates

Free software upgrades for the lifetime of the machine — no hidden subscription fees.

Technical Specifications

All specifications are typical values. Custom configurations available on request — please contact our European technical sales team for project-specific requirements.

Maximum wafer size10" (250 mm)
Spindle typeHigh-power DC, max torque
Spindle speedConfigurable (specifications on request)
Cutting accuracy±3 μm typical
XY stage typeLinear servo with optical encoder
Pattern recognitionAutomatic optical alignment system
Power supply380 V AC, 3-phase
Compressed air0.5–0.7 MPa, dry & clean
Cooling waterDI water, filtered, recirculated
Compatible bladesQisheng full range + third-party hub blades
Warranty12 months standard, lifetime software updates

Specifications subject to change without notice. Please confirm latest values with sales when placing order.

Typical Applications

The QSD1030 is deployed across multiple industries and substrate types:

Compatibility & Consumables

The QSD1030 accepts the full range of Qisheng Precision dicing blades — resin-bond, metal-bond and electroformed — as well as third-party hub blades from major suppliers. Compatible accessories include ceramic vacuum chuck tables, diamond dresser boards and custom flanges manufactured in-house.

View dicing blade portfolio →  |  View accessories →

Interested in the QSD1030?

Get a personalised quotation, discuss your specific application requirements, or request a live demonstration. Our European technical sales team responds to all enquiries within one business day.

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