Since 2014, Qisheng Precision has remained focused on the semiconductor and precision manufacturing industries, specialising in the R&D and production of dicing equipment, superhard cutting tools and precision grinding products.
We are one of China's very few national high-tech enterprises with dual independent R&D capability in both equipment and blades — giving customers a truly integrated solution partner under one roof.
Three business divisions cover the complete value chain: equipment R&D, blade & wheel manufacturing, and process engineering support. Products are used by 1,000+ companies across 30+ provinces.
Learn More →Precision dicing saws, diamond blades and grinding wheels for the electronics industry
Precision dicing platforms in 6", 8" and 10" wafer formats. High-power DC spindles with auto pattern recognition.
Resin, metal and electroformed blade formulations. Compatible with Disco, ACCRETECH and all major dicing saws.
Silicon wafer thinning, sapphire chamfering and photovoltaic silicon grinding. Long life, low surface damage.
Engineered for semiconductor, LED, photovoltaic, IC packaging and ceramics industries
European technical sales team — response within 1 business day. Free evaluation samples for qualified customers.
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